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MIC2039AYMT-TR - Microchip

Description: Power Switch ICs - Power Distribution ADJ, High-Side, Power Distribution Switch

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Symbol
MIC2039AYMT-TR - Microchip - PCB symbol
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PCB Footprints
MIC2039AYMT-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 6-Lead UDFN 2 mm x 2 mm
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3D Models
MIC2039AYMT-TR - Microchip - 3D model - Small Outline No-lead - 6-Lead UDFN 2 mm x 2 mm
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MIC2039AYMT-TR Details

  • Manufacturer Part Number:

    MIC2039AYMT-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVSON, SOLCC6,.08,25

  • Pin Count:

    6

  • Manufacturer Package Code:

    UDFN-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.6 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +2.25V, +2.15V

  • Width:

    2 mm

MIC2039AYMT-TR Frequently Asked Questions (FAQs)

  • A good thermal layout is crucial for the MIC2039AYMT-TR. Ensure that the thermal pad is connected to a large copper area on the PCB, and use thermal vias to dissipate heat efficiently. Avoid routing high-current traces near the thermal pad to minimize thermal resistance.
  • To ensure reliable hot-swap operation, make sure to follow the recommended circuit layout and component selection guidelines. Use a suitable input capacitor to filter out voltage transients, and ensure that the output capacitor is properly sized to handle the inrush current.
  • For effective EMI filtering and shielding, use a common-mode choke and a differential-mode filter capacitor to reduce electromagnetic interference. Ensure that the PCB layout is designed to minimize radiation and that the device is properly shielded using a metal enclosure or shielded cables.
  • To troubleshoot issues with the MIC2039AYMT-TR, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly configured and that the input and output capacitors are properly sized. Use an oscilloscope to analyze the waveforms and identify any anomalies.
  • For high-current applications, ensure that the MIC2039AYMT-TR is properly heatsinked to prevent overheating. Use a thermal interface material to improve heat transfer, and consider using a fan or other cooling system to maintain a safe operating temperature.

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MIC2039AYMT-TR Overview

Use the download button to access the MIC2039AYMT-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MIC20, or try a keyword search, such as Power Management Circuits

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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