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MIC5320-SJYD6-TR - Microchip

Description: IC REG LINEAR 2.5V/3.3V TSOT23-6

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MIC5320-SJYD6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-PIN TSOT-23(D6)
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MIC5320-SJYD6-TR - Microchip  - 3D model - SOT23 (6-Pin) - 6-PIN TSOT-23(D6)
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MIC5320-SJYD6-TR Details

  • Manufacturer Part Number:

    MIC5320-SJYD6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    TSOT-6

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.1 V

  • Dropout Voltage1-Nom:

    0.035 V

  • Dropout Voltage2-Max:

    0.1 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Load Regulation-Max:

    0.066%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Current2-Max:

    0.15 A

  • Output Voltage1-Max:

    3.399 V

  • Output Voltage1-Min:

    3.201 V

  • Output Voltage1-Nom:

    3.3 V

  • Output Voltage2-Max:

    2.575 V

  • Output Voltage2-Min:

    2.425 V

  • Output Voltage2-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.6 mm

MIC5320-SJYD6-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to minimize thermal resistance. A minimum of 2 oz copper thickness is recommended for optimal thermal performance.
  • To ensure stable output voltage, it is recommended to use a high-quality input capacitor with low ESR, and to decouple the output with a capacitor of at least 10uF. Additionally, the MIC5320 has a built-in soft-start feature that helps to reduce inrush current and ensure stable output voltage during startup.
  • The MIC5320 is rated for operation up to 125°C ambient temperature, but it is recommended to derate the output current and voltage to ensure reliable operation at high temperatures. Consult the datasheet for derating curves and guidelines.
  • The MIC5320 has built-in overcurrent protection (OCP) and short-circuit protection (SCP) features. The OCP threshold is set to 2.5A, and the SCP response time is typically 1us. Additionally, it is recommended to use external fuses or current-limiting resistors to protect the device from excessive current.
  • Microchip recommends using a high-quality, low-ESR ceramic capacitor with a value of at least 10uF and a voltage rating of 6.3V or higher. X5R or X7R dielectric types are recommended for their low ESR and high reliability.

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MIC5320-SJYD6-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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