MPC564CZP66 - NXP

MPC564CZP66 Details

• Manufacturer Part Number:

  MPC564CZP66

• Part Life Cycle Code:

  Obsolete

• Package Description:

  27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388

• Country Of Origin:

  Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  NO

• Address Bus Width:

  24

• Bit Size:

  32

• Boundary Scan:

  NO

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• External Data Bus Width:

  32

• JESD-30 Code:

  S-PBGA-B388

• JESD-609 Code:

  e0

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  16

• Number of Terminals:

  388

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA388,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  240

• Qualification Status:

  Not Qualified

• RAM (bytes):

  32768

• ROM (words):

  524288

• ROM Programmability:

  FLASH

• Seated Height-Max:

  2.55 mm

• Speed:

  66 MHz

• Supply Voltage-Max:

  2.7 V

• Supply Voltage-Min:

  2.6 V

• Supply Voltage-Nom:

  2.6 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC