The recommended land pattern for NTCS0805E3103HHT is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0805E3103HHT has a high operating temperature range of -55°C to 150°C, it's essential to consider the derating of the component's characteristics at high temperatures. Consult the datasheet and application notes for specific guidance on using this component in high-temperature applications.
NTCS0805E3103HHT is an ESD-sensitive component. To prevent damage, handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the assembly process and storage environment are ESD-controlled.
The recommended soldering profile for NTCS0805E3103HHT is a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds. Consult the datasheet and application notes for specific guidance on soldering profiles.
NTCS0805E3103HHT is a moisture-sensitive component. To prevent damage, ensure that the component is stored in a dry environment with a relative humidity below 60%. If the component is exposed to moisture, bake it according to the datasheet's recommended moisture-sensitivity level (MSL) procedure.
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NTCS0805E3103HHT Overview
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