OPA2992IDSGR footprint, schematic symbol and 3D model by Texas Instruments

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PCB Footprints

OPA2992IDSGR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - WSON

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Part Number OPA2992IDSGR
Manufacturer Texas Instruments
Pin Count 9
Part Category Diode ESD (Uni-directional)
Package Category Quad Flat No-Lead
Footprint Name Quad Flat No-Lead - WSON
Pinout / Pin List Click Here (Member Only)

OPA2992IDSGR Details

Manufacturer Part Number:
OPA2992IDSGR
Brand Name:
Texas Instruments
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
HTS Code:
8542.33.00.01
Manufacturer:
Texas Instruments
YTEOL:
15
Amplifier Type:
OPERATIONAL AMPLIFIER
Architecture:
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min:
75 dB
Common-mode Reject Ratio-Nom:
115 dB
Frequency Compensation:
YES
Input Offset Voltage-Max:
1000 µV
JESD-30 Code:
S-PDSO-N8
JESD-609 Code:
e4
Length:
2 mm
Low-Bias:
YES
Low-Offset:
NO
Micropower:
NO
Moisture Sensitivity Level:
1
Number of Functions:
2
Number of Terminals:
8
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVSON
Package Equivalence Code:
SOLCC8,.08,20
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method:
TR, 7 INCH
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Seated Height-Max:
0.8 mm
Slew Rate-Nom:
32 V/us
Supply Current-Max:
5.68 mA
Supply Voltage Limit-Max:
42 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
10600
Voltage Gain-Min:
158489.3192
Wideband:
NO
Width:
2 mm

OPA2992IDSGR Frequently Asked Questions (FAQs)

Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure high-frequency stability and low noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
The OPA2992IDSGR has internal ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
The maximum power dissipation for OPA2992IDSGR is dependent on the ambient temperature and the thermal resistance of the PCB. As a general rule, the maximum power dissipation is around 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal design considerations in the datasheet for more detailed information.
The OPA2992IDSGR is specified to operate from -40°C to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper thermal management to ensure reliable operation in high-temperature environments.
The input and output capacitors should be selected based on the frequency response, impedance, and noise requirements of the application. A general rule of thumb is to use low-ESR capacitors with a value between 10nF to 100nF for input and output decoupling. However, it's recommended to consult the application notes and datasheet for more detailed information on capacitor selection.

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OPA2992IDSGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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