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PACDN006MR - onsemi

Description: Obsolete - ESD Protection Array

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PACDN006MR - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - MSOP8 CASE846AB-1 ISSUE O
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PACDN006MR - onsemi  - 3D model - Small Outline Packages - MSOP8 CASE846AB-1 ISSUE O
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PACDN006MR Details

  • Manufacturer Part Number:

    PACDN006MR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Micro 8 lead Surface Mount

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    846A-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Clamping Voltage-Max:

    13 V

  • Configuration:

    COMPLEX, 6 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    12

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, MIL-STD-883

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PACDN006MR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the package and heat sink, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling capability at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage below 5V.
  • Yes, the PACDN006MR is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB layout and decoupling techniques to minimize parasitic inductance and capacitance.
  • The PACDN006MR has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.

Trust Checks

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PACDN006MR Overview

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