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PI3B3251QE - Diodes Incorporated

Description: Encoders, Decoders, Multiplexers & Demultiplexers 3.3V 8:1 Demux Mux Bus Switch

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PI3B3251QE - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - 16-TSSOP (L)A
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PI3B3251QE - Diodes Incorporated  - 3D model - Small Outline Packages - 16-TSSOP (L)A
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PI3B3251QE Details

  • Manufacturer Part Number:

    PI3B3251QE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, GREEN, PLASTIC, MO-137B/AB, QSOP-16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Family:

    CBTLV/3B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    9

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.63 V

  • Supply Voltage-Min (Vsup):

    2.97 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

PI3B3251QE Frequently Asked Questions (FAQs)

  • A good PCB layout for the PI3B3251QE involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, connect the VCC pin to a stable 1.8V to 3.3V power supply, and configure the device using the EN, SEL, and DIR pins according to the datasheet.
  • The PI3B3251QE has a maximum junction temperature of 150°C. Ensure good thermal conductivity by using a heat sink or a thermal pad, and avoid overheating by keeping the device within the recommended operating temperature range.
  • To troubleshoot issues, check the power supply voltage, ensure proper configuration and pin connections, verify the input and output signals, and use a logic analyzer or oscilloscope to debug the device's behavior.
  • Yes, the PI3B3251QE has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and handling to prevent damage. Use an ESD wrist strap or mat, and ensure the device is stored in an ESD-safe environment.

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PI3B3251QE Overview

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