TTL COMPATIBLE MUX/DMUX SWITCH; MAX RON = 15 OHM @ VIN 2.4V & ION = 15MA
Family:
CBT/FST/QS/5C/B
JESD-30 Code:
R-PDSO-G16
JESD-609 Code:
e3
Length:
4.9 mm
Load Capacitance (CL):
50 pF
Logic IC Type:
BUS EXCHANGER
Moisture Sensitivity Level:
1
Number of Bits:
4
Number of Functions:
2
Number of Ports:
5
Number of Terminals:
16
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Characteristics:
3-STATE
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SSOP16,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd):
0.25 ns
Qualification Status:
Not Qualified
Seated Height-Max:
1.75 mm
Supply Voltage-Max (Vsup):
5.25 V
Supply Voltage-Min (Vsup):
4.75 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.635 mm
Terminal Position:
DUAL
Width:
3.9 mm
PI5C3253QE Frequently Asked Questions (FAQs)
A good PCB layout for the PI5C3253QE involves keeping the signal traces short and direct, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and crosstalk.
The PI5C3253QE requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator (LDO) to power the device. The power sequencing requirement is to power up the VCC pin before the VEE pin. It's also recommended to add decoupling capacitors close to the power pins to filter out noise and reduce power supply ripple.
The PI5C3253QE is designed to operate up to 250 MHz. However, the actual operating frequency may be limited by the system's signal integrity, PCB layout, and other factors. It's recommended to perform signal integrity simulations and testing to determine the maximum operating frequency for a specific application.
The PI5C3253QE has a thermal pad on the bottom of the package, which is connected to the die. It's recommended to use a thermal interface material (TIM) to improve heat transfer between the thermal pad and the PCB. Additionally, it's recommended to use a heat sink or a thermal management system to dissipate heat generated by the device.
The PI5C3253QE has built-in ESD protection diodes on the input pins. However, it's still recommended to use external ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge. Additionally, it's recommended to follow proper PCB design and layout practices to prevent latch-up, such as using a solid ground plane and avoiding parallel signal traces.
Trust Checks
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Manufacturer Collaborated
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System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
PI5C3253QE Overview
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