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QS3383QG8 - Renesas Electronics

Description: The QS3383 provides ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3383 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Bus exchange configuration allows byte swapping of buses in systems. It can also be used as a 5-wide 2-to-1 multiplexer and to create low delay barrel shifters, etc. The QS3383 operates at -40C to +85C.

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QS3383QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG24-+-+-
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QS3383QG8 - Renesas Electronics  - 3D model - Small Outline Packages - PCG24-+-+-
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QS3383QG8 Details

  • Manufacturer Part Number:

    QS3383QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QSOP

  • Package Description:

    QSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    PCG24

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    TTL COMPATIBLE BUS SWITCH

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    3383

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.69 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Ports:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    2.5 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.94 mm

QS3383QG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes layout considerations for signal integrity, power supply, and thermal management.
  • Renesas recommends following the thermal design guidelines in the datasheet and application notes. This includes using a heat sink, ensuring good airflow, and selecting a suitable thermal interface material. Additionally, consider using thermal simulation tools to optimize the design.
  • The input capacitors should be selected based on the specific application requirements, such as voltage rating, capacitance value, and ESR. Renesas recommends using low-ESR capacitors with a voltage rating of at least 1.5 times the maximum input voltage. The capacitance value should be chosen to ensure the desired ripple voltage and transient response.
  • Renesas provides a troubleshooting guide in their application notes, which covers common issues and their possible causes. Additionally, engineers can use oscilloscopes and other diagnostic tools to analyze the device's behavior and identify the root cause of the issue.
  • Yes, Renesas provides specific guidelines and recommendations for using the QS3383QG8 in automotive and industrial applications, including considerations for electromagnetic compatibility (EMC), electrostatic discharge (ESD), and environmental stress testing.

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QS3383QG8 Overview

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