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QS3VH251PAG - Renesas Electronics

Description: The QS3VH251 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH251 ideal for high performance comminucation applications. The QS3VH251 operates from -40C to +85C.

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QS3VH251PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG16-55
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QS3VH251PAG - Renesas Electronics  - 3D model - Small Outline Packages - PGG16-55
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QS3VH251PAG Details

  • Manufacturer Part Number:

    QS3VH251PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PGG16

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    9

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.03 mA

  • Prop. Delay@Nom-Sup:

    0.2 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

QS3VH251PAG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout and thermal management guide in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reduce thermal issues, and prevent damage to the device.
  • Renesas provides a hot swap and hot plug application note that outlines the necessary circuitry and design considerations. Additionally, the device's built-in features, such as overcurrent protection and undervoltage lockout, can be used to implement hot swap and hot plug functionality.
  • The QS3VH251PAG has built-in ESD protection diodes and latch-up prevention circuits. However, it's still essential to follow proper ESD handling and storage procedures, and to design the PCB with ESD protection in mind. Renesas also recommends using additional external ESD protection devices if necessary.
  • Renesas provides a troubleshooting guide and debug tools, such as oscilloscopes and logic analyzers, to help identify and resolve issues. Additionally, engineers can use the device's built-in diagnostic features, such as error flags and status registers, to aid in debugging.
  • Renesas provides reliability and quality metrics, including MTBF and FIT rates, in their product reliability reports and quality documents. These metrics can be used to estimate the device's reliability and failure rates in specific applications.

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QS3VH251PAG Overview

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