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QS3VH251QG8 - Renesas Electronics

Description: The QS3VH251 HotSwitch Quad 2:1 multiplexer/demultiplexer is a high bandwidth bus switch with very low ON resistance, resulting in under 250ps propagation delay through the switch. The combination of near-zero propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH251 ideal for high performance comminucation applications. The QS3VH251 operates from -40C to +85C.

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QS3VH251QG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG16-ren1
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QS3VH251QG8 Details

  • Manufacturer Part Number:

    QS3VH251QG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QSOP

  • Package Description:

    QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    PCG16

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Inputs:

    8

  • Number of Ports:

    9

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.03 mA

  • Prop. Delay@Nom-Sup:

    0.2 ns

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

QS3VH251QG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes layout considerations for signal integrity, power supply, and thermal management.
  • To ensure reliable operation, follow the recommended operating conditions, including voltage and temperature ranges, as specified in the datasheet. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
  • Renesas recommends following a specific power-up and power-down sequence to prevent damage to the device. This information can be found in the datasheet or in the application notes. Typically, the sequence involves powering up the VCC supply before the VDD supply, and powering down the VDD supply before the VCC supply.
  • Renesas recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect the device from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • The QS3VH251QG8 has specific limitations on signal integrity and jitter performance, which can be found in the datasheet or in application notes. These limitations include maximum allowable jitter, signal rise and fall times, and signal amplitude requirements.

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QS3VH251QG8 Overview

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