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RL1220S-R10-G - Susumu

Description: RESISTOR, 0805 0.1 Ohm ± 2% 0.25 W

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PCB Footprints
RL1220S-R10-G - Susumu PCB footprint - Other - Other - RESC2013X65N
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3D Models
RL1220S-R10-G - Susumu  - 3D model - Other - RESC2013X65N
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RL1220S-R10-G Details

  • Manufacturer Part Number:

    RL1220S-R10-G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.4 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper

  • Rated Power Dissipation (P):

    0.333 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.1 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    0,200 ppm/°C

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    2%

  • Working Voltage:

    0.1825 V

RL1220S-R10-G Frequently Asked Questions (FAQs)

  • The recommended land pattern for RL1220S-R10-G is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure that the component is placed on a thermal land with a size of at least 2mm x 2mm, and use a thermal via to connect to a solid copper plane on the bottom layer.
  • The maximum operating temperature for RL1220S-R10-G is 125°C, with a derating of 1.25% per °C above 85°C.
  • Yes, RL1220S-R10-G is suitable for high-frequency applications up to 1 GHz, but ensure that the PCB layout and component placement are optimized for high-frequency performance.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, and consider using a moisture-resistant coating on the component itself.

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