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S27KL0642DPBHB023 - Infineon

Description: DRAM SPCM

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PCB Footprints
S27KL0642DPBHB023 - Infineon PCB footprint - BGA - BGA - 24-ball 6mm x 8mm 1.0 mm (VAA024)
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3D Models
S27KL0642DPBHB023 - Infineon  - 3D model - BGA - 24-ball 6mm x 8mm 1.0 mm (VAA024)
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S27KL0642DPBHB023 Details

  • Manufacturer Part Number:

    S27KL0642DPBHB023

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.02

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    200 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    24

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Self Refresh:

    YES

  • Standby Current-Max:

    0.00036 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

S27KL0642DPBHB023 Frequently Asked Questions (FAQs)

  • Infineon provides a separate application note (AN215) that outlines the recommended PCB layout and design guidelines for the S27KL0642DPBHB023. It's essential to follow these guidelines to ensure reliable operation and minimize signal integrity issues.
  • According to Infineon's technical support, it's recommended to tie the hold (HOLD) pin to VCC and the write protect (WP) pin to GND during power-up and power-down sequences to ensure proper device operation and prevent accidental writes or erases.
  • The S27KL0642DPBHB023 has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles per device. However, it's essential to follow the recommended usage and wear-leveling guidelines to ensure the device's endurance.
  • Although the S27KL0642DPBHB023 is specified for 2.7V to 3.6V operation, Infineon's technical support suggests that it can be used in a system with a 1.8V power supply, but with reduced performance and potentially lower reliability. It's recommended to consult with Infineon's technical support for specific guidance.
  • Infineon provides a separate security application note (AN223) that outlines the recommended implementation of secure erase and secure boot mechanisms for the S27KL0642DPBHB023. It's essential to follow these guidelines to ensure the security and integrity of the system.

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