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SC68376BAMAB20 - NXP

Description: MCU

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PCB Footprints
SC68376BAMAB20 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 160-QFP (28x28)
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3D Models
SC68376BAMAB20 - NXP  - 3D model - Quad Flat Packages - 160-QFP (28x28)
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SC68376BAMAB20 Details

  • Manufacturer Part Number:

    SC68376BAMAB20

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    28 X 28 MM, 3.30 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-160

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    20.97 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G160

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    39

  • Number of Terminals:

    160

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • ROM (words):

    8192

  • ROM Programmability:

    MROM

  • Seated Height-Max:

    3.85 mm

  • Speed:

    20.97 MHz

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    HCMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

SC68376BAMAB20 Frequently Asked Questions (FAQs)

  • NXP recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
  • Implement thermal management techniques such as heat sinks, thermal interfaces, and airflow management. Ensure the device is operated within the specified temperature range (-40°C to 125°C) and consider using thermal simulation tools to optimize the design.
  • Use a minimum of 10uF decoupling capacitors for each power pin, placed as close to the device as possible. Add additional filtering components (e.g., ferrite beads, inductors) to reduce noise and ensure a stable power supply.
  • Use the device's power-saving modes (e.g., sleep, standby), optimize clock frequencies, and minimize unnecessary peripheral usage. Consider using a power management IC to regulate voltage and current.
  • Implement ESD protection devices (e.g., TVS diodes, ESD arrays) on all external interfaces and ensure that the PCB design includes ESD protection features such as guard rings and ESD-safe layout practices.

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SC68376BAMAB20 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image SC68376BAMAB20 Rochester Electronics LLC

32-BIT, MROM, 20.97MHz, MICROCONTROLLER, PQFP160, 28 X 28 MM, 3.30 MM HEIGHT, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-160

Part Image MC68376BAMAB20 Freescale Semiconductor

Microcontroller, 32-Bit, MROM, 20.97MHz, HCMOS, PQFP160