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SLG59M309V - Renesas Electronics

Description: The SLG59M309V is a 7.8 mΩ 4 A single-channel load switch that is able to switch 1 to 5.5 V power rails. The product is packaged in an ultra-small 1.5 mm x 2.0 mm package.

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SLG59M309V - Renesas Electronics PCB footprint - Other - Other - SLG59M309V
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SLG59M309V Details

  • Manufacturer Part Number:

    SLG59M309V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN-8 (1.5 x 2.0 mm)

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    SOLCC8,.06,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.1 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    1.5 mm

SLG59M309V Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-114) for the SLG59M309V. It suggests using a 4-layer PCB with a solid ground plane, placing the device near the center of the board, and using thermal vias to dissipate heat.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust thermal management system. Additionally, consider using a heat sink or a thermal pad to dissipate heat.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially cause permanent damage. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To troubleshoot issues related to the internal voltage regulator, check the input voltage, output voltage, and current consumption. Verify that the input voltage is within the recommended range, and the output voltage is stable. Also, ensure that the device is properly decoupled, and the layout is optimized for minimal noise and EMI.
  • When using the SLG59M309V in a high-reliability or safety-critical application, consider implementing redundant systems, error detection and correction mechanisms, and fault-tolerant design principles. Additionally, ensure that the device is properly qualified and certified for the specific application, and follow relevant industry standards and guidelines.

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SLG59M309V Overview

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