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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SMD1812B200TF/16
- Part Number SMD1812B200TF/16
- Manufacturer Yageo Group
- Last Modified Date Jun 28, 2026 8:38 PM UTC
- Pinout / Pin List Click Here (Member Only)
SMD1812B200TF/16 Details
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Manufacturer Part Number:
SMD1812B200TF/16
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Mainland China, Taiwan
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ECCN Code:
EAR99
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HTS Code:
8533.40.80.70
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Factory Lead Time:
21 Weeks, 1 Day
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Manufacturer:
YAGEO Corporation
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YTEOL:
8.25
SMD1812B200TF/16 Frequently Asked Questions (FAQs)
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The recommended land pattern for SMD1812B200TF/16 is a rectangular pad with a size of 1.3mm x 1.8mm, with a solder mask clearance of 0.1mm. The land pattern should be designed to accommodate the component's dimensions and solder fillet requirements.
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SMD1812B200TF/16 is a moisture-sensitive device (MSD). It should be stored in a dry environment with a relative humidity of less than 30%. Before reflow soldering, the component should be baked at 125°C for 24 hours to remove any moisture. It's also recommended to use a dry pack or a vacuum-sealed bag to store the components.
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The maximum reflow soldering temperature for SMD1812B200TF/16 is 260°C. The component should be exposed to this temperature for no more than 30 seconds to prevent damage or degradation.
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While SMD1812B200TF/16 is a robust component, it's not designed for high-vibration environments. If your application requires high vibration resistance, you may need to consider additional mechanical support or a different component with higher vibration tolerance.
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To ensure the reliability of SMD1812B200TF/16 in a high-temperature environment, it's essential to follow the recommended derating guidelines. The component's power rating should be derated by 1.25% for every 1°C above 70°C. Additionally, the component should be used within its specified operating temperature range of -55°C to 150°C.
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SMD1812B200TF/16 Overview
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