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SMDJ33CA/TR13 - Yageo Group

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SMDJ33CA/TR13 Details

  • Manufacturer Part Number:

    SMDJ33CA/TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    20 Weeks, 2 Days

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.66

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMDJ33CA/TR13 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMDJ33CA/TR13 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • SMDJ33CA/TR13 is a moisture-sensitive device (MSD) and requires special handling to prevent damage. It should be stored in a dry environment with a relative humidity of less than 30% and a temperature range of 10°C to 30°C. Before reflow soldering, the components should be baked at 125°C for 24 hours to remove any moisture.
  • The maximum reflow temperature for SMDJ33CA/TR13 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The reflow profile should follow the JEDEC J-STD-020 standard.
  • SMDJ33CA/TR13 is a surface-mount device and may not be suitable for high-vibration environments. The component's solder joints may be prone to fatigue and cracking under high-vibration conditions. If high vibration is expected, a more robust component or additional mechanical support may be required.
  • To ensure the reliability of SMDJ33CA/TR13 in a high-temperature environment, it is recommended to follow the derating guidelines provided in the datasheet. The component's power rating should be derated by 1.25% for every 1°C above 70°C. Additionally, the component's operating temperature should be monitored to prevent overheating.

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SMDJ33CA/TR13 Overview

Use the download button to access the SMDJ33CA/TR13 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SMDJ3, or try a keyword search, such as Transient Suppressors

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Part Image 3.0SMCJ33C MDE Semiconductor Inc

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Part Image SMDJ33CA/TR13 Pulse Electronics Corporation

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Part Image SMDJ33CA/TR13 BrightKing Inc

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Part Image SMC3K33CAHM3/9A Vishay Semiconductors

DIODE 3000 W, BIDIRECTIONAL, SILICON, TVS DIODE, DO-214AB, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SMC, 2 PIN, Transient Suppressor

Part Image 3.0SMCJ33CA-T3 Sangdest Microelectronics (Nanjing) Co Ltd

Trans Voltage Suppressor Diode, 3000W, 33V V(RWM), Bidirectional, 1 Element, Silicon, DO-214AB

For a full list of alternate parts for SMDJ33CA/TR13, check out Findchips.com