Part Image

SPC5517SBMLQ66 - NXP

Description: Microcontroller

Download SPC5517SBMLQ66 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SPC5517SBMLQ66 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144 (SOT486-2)
click to zoom
3D Models
SPC5517SBMLQ66 - NXP  - 3D model - Quad Flat Packages - LQFP144 (SOT486-2)
click to zoom

SPC5517SBMLQ66 Details

  • Manufacturer Part Number:

    SPC5517SBMLQ66

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    E200

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    111

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    81920

  • ROM (words):

    196608

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Speed:

    66 MHz

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5517SBMLQ66 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the SPC5517SBMLQ66 in the 'SPC5517SBMLQ66 PCB Layout Guidelines' document, which can be found on the NXP website. This guide provides detailed information on component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The SPC5517SBMLQ66 has several low-power modes that can be configured using the Power Management Controller (PMC). The PMC can be programmed to reduce power consumption by shutting down or gating off unused peripherals, reducing clock frequencies, and adjusting voltage levels. Refer to the 'SPC5517SBMLQ66 Reference Manual' for detailed information on configuring low-power modes.
  • The SPC5517SBMLQ66 is rated for operation over a temperature range of -40°C to 125°C (junction temperature). However, the device can be operated at temperatures up to 150°C with reduced performance and reliability. It is essential to ensure proper thermal management and cooling to maintain optimal performance and reliability.
  • The SPC5517SBMLQ66 has a built-in Secure Boot mechanism that ensures the authenticity and integrity of the boot process. To implement secure boot, you need to generate a secure boot key, configure the Boot ROM to use the secure boot key, and ensure that the boot loader and application software are signed with the secure boot key. Refer to the 'SPC5517SBMLQ66 Secure Boot Guide' for detailed information on implementing secure boot.
  • NXP recommends using high-quality, low-ESR decoupling capacitors with a value of 100nF to 1uF, placed as close as possible to the power pins of the SPC5517SBMLQ66. The capacitors should be rated for the maximum operating voltage and should have a low inductance to minimize noise and ripple.

Trust Checks

This model has been verified by system checks.
System Verified
Sponsored

SPC5517SBMLQ66 Overview

Use the download button to access the SPC5517SBMLQ66 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SPC55, or try a keyword search, such as Microcontrollers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to SPC5517SBMLQ66

Showing 0 results

SPC5517SBMLQ66 Alternates

Showing results

Image Part Number Model
Part Image SPC5517SBMLQ66 Freescale Semiconductor

Microcontroller, 32-Bit, FLASH, E200 CPU, 66MHz, CMOS, PQFP144