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SPC5676RDK3MVU1 - NXP

Description: 32-bit Microcontrollers - MCU NXP 32-bit MCU, Power Arch core, 6MB Flash, 184MHz, -40/+125degC, Automotive Grade, PBGA 416

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SPC5676RDK3MVU1 - NXP - PCB symbol
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PCB Footprints
SPC5676RDK3MVU1 - NXP PCB footprint - BGA - BGA - SPC5676RDK3MVU1
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SPC5676RDK3MVU1 - NXP - 3D model - BGA - SPC5676RDK3MVU1
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SPC5676RDK3MVU1 Details

  • Manufacturer Part Number:

    SPC5676RDK3MVU1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Address Bus Width:

    32

  • Bit Size:

    32

  • CPU Family:

    E200

  • Clock Frequency-Max:

    40 MHz

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B416

  • JESD-609 Code:

    e2

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    182

  • Number of Terminals:

    416

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA416,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    393216

  • ROM (words):

    6291456

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Speed:

    180 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SPC5676RDK3MVU1 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SPC5676RDK3MVU1 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • The clock settings for the SPC5676RDK3MVU1 can be configured using the Clock Generation Module (CGM) registers. The CGM module generates the clock signals for the processor, peripherals, and other modules. Refer to the device's reference manual for detailed information on clock configuration.
  • The maximum frequency of the SPC5676RDK3MVU1 is 264 MHz, as specified in the datasheet. However, the actual operating frequency may vary depending on the application, voltage, and temperature.
  • The SPC5676RDK3MVU1 has several low-power modes, including Stop, Sleep, and Wait modes. These modes can be implemented using the Power Management Module (PMM) registers. The PMM module controls the power modes and voltage scaling of the device. Refer to the device's reference manual for detailed information on low-power mode implementation.
  • The SPC5676RDK3MVU1 has 3.5 MB of Flash memory and 256 KB of RAM. However, the actual available memory may vary depending on the application and configuration.

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SPC5676RDK3MVU1 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image SPC5676RDK3MVU1 Freescale Semiconductor

Microcontroller, 32-Bit, FLASH, E200 CPU, 180MHz, PBGA416