SPC5676RDK3MVY1 - NXP

SPC5676RDK3MVY1 Details

• Manufacturer Part Number:

  SPC5676RDK3MVY1

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TEBGA-516

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• External Data Bus Width:

  32

• JESD-30 Code:

  S-PBGA-B516

• JESD-609 Code:

  e2

• Length:

  27 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  216

• Number of Terminals:

  516

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  393216

• ROM (words):

  6291456

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  2.55 mm

• Speed:

  184 MHz

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER