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TH3B105K035C4400 - Vishay

Description: Solid Tantalum Surface Mount Capacitors TANTAMOUNT(TM) Molded Case, HI-TMP® High Temperature 150 °C, Automotive Grade

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TH3B105K035C4400 - Vishay - PCB symbol
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PCB Footprints
TH3B105K035C4400 - Vishay PCB footprint - Capacitor Moulded Polarised - Capacitor Moulded Polarised - Case Code B
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3D Models
TH3B105K035C4400 - Vishay - 3D model - Capacitor Moulded Polarised - Case Code B
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TH3B105K035C4400 Details

  • Manufacturer Part Number:

    TH3B105K035C4400

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Israel, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    9

  • Additional Feature:

    ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ

  • Capacitance:

    1 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Dielectric Material:

    TANTALUM (DRY/SOLID)

  • ESR:

    4400 mΩ

  • Height:

    1.9 mm

  • JESD-609 Code:

    e3

  • Leakage Current:

    0.0005 mA

  • Length:

    3.5 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, EMBOSSED PLASTIC, 7 INCH

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    35 V

  • Reference Standard:

    AEC-Q200

  • Ripple Current:

    140 mA

  • Size Code:

    1411

  • Surface Mount:

    YES

  • Tan Delta:

    0.04

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    J BEND

  • Width:

    2.8 mm

TH3B105K035C4400 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TH3B105K035C4400 can be found in the Vishay Intertechnologies' application note AN48374, which provides guidelines for PCB layout and land pattern design.
  • The TH3B105K035C4400 has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and follow the thermal design guidelines in the datasheet to prevent overheating.
  • The derating curve for the TH3B105K035C4400 can be found in the datasheet, which provides information on the device's power handling capabilities at different temperatures.
  • Yes, the TH3B105K035C4400 is suitable for high-reliability applications. It is built with high-quality materials and has undergone rigorous testing to ensure its reliability and performance.
  • Follow the recommended soldering profile and guidelines in the datasheet to ensure proper soldering of the TH3B105K035C4400. Use a soldering iron with a temperature range of 250°C to 260°C, and avoid overheating the component.

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TH3B105K035C4400 Overview

Use the download button to access the TH3B105K035C4400 schematic symbol, PCB footprint, and 3D model.
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