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TLV387DBVR - Texas Instruments

Description: Precision Amplifiers Ultra-high precision, zero-drift, low-input-bias-current single op amp

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PCB Footprints
TLV387DBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SOT-23
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3D Models
TLV387DBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - 5-Pin SOT-23
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TLV387DBVR Details

  • Manufacturer Part Number:

    TLV387DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00035 µA

  • Bias Current-Max (IIB) @25C:

    0.0003 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    150 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2.8 V/us

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5700

  • Voltage Gain-Min:

    562341.3

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV387DBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, and placing the device close to the power supply and ground pins. Additionally, it's essential to separate the analog and digital grounds, and to use a solid ground plane to reduce noise and electromagnetic interference (EMI).
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 1-10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 10-100uF. The capacitor values and types may vary depending on the specific application and operating conditions.
  • The TLV387DBVR has an operating temperature range of -40°C to 125°C, but it's essential to consider the derating of the device's performance and reliability at higher temperatures.
  • To ensure stability, it's crucial to follow the recommended layout and placement guidelines, use the correct input and output capacitors, and ensure that the device is properly decoupled from the power supply. Additionally, the device's output should be loaded with a minimum of 1kΩ to prevent oscillation.
  • The recommended power-up sequence is to apply the power supply voltage (VCC) before applying the input voltage (VIN). This ensures that the device is properly biased and configured before the input voltage is applied.

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TLV387DBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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