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VND830LSP-E - STMicroelectronics

Description: Power Switch/Driver 1:1 N-Channel 18A 10-PowerSO , Surface Mount , 18 A , 60mOhm (Max) , 5.5V ~ 36V , -40°C ~ 150°C (TJ)

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VND830LSP-E - STMicroelectronics - PCB symbol
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VND830LSP-E - STMicroelectronics PCB footprint - Other - Other - PowerSO-10_2026-1.9
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VND830LSP-E Details

  • Manufacturer Part Number:

    VND830LSP-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, POWER, SO-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    9.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    18 A

  • Output Peak Current Limit-Nom:

    23 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP10,.55FL

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.75 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VND830LSP-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN4979, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The selection of external components such as resistors, capacitors, and inductors depends on the specific application and operating conditions. STMicroelectronics provides a component selection guide in the application note AN4979, which includes formulas and guidelines for selecting the correct components.
  • The VND830LSP-E is rated for operation from -40°C to 150°C, but the maximum operating temperature range may vary depending on the specific application and operating conditions. It is recommended to consult the datasheet and application notes for more information.
  • STMicroelectronics provides a troubleshooting guide in the application note AN4979, which includes common issues, symptoms, and solutions for the VND830LSP-E. Additionally, engineers can consult the datasheet and contact STMicroelectronics support for further assistance.
  • The VND830LSP-E is a high-voltage device and requires proper handling and safety precautions to avoid electrical shock, injury, or damage. Engineers should follow proper safety guidelines, such as wearing protective gear, using insulated tools, and ensuring proper grounding and isolation.

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VND830LSP-E Overview

Use the download button to access the VND830LSP-E schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like VND83, or try a keyword search, such as Peripheral Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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