W66CP2NQUAFJ - Winbond

W66CP2NQUAFJ Details

• Manufacturer Part Number:

  W66CP2NQUAFJ

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  WFBGA-200

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Date Of Intro:

  2020-06-23

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  5

• Access Mode:

  MULTI BANK PAGE BURST

• Access Time-Max:

  3.5 ns

• Additional Feature:

  AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX

• Clock Frequency-Max (fCLK):

  1600 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  16,32

• JESD-30 Code:

  R-PBGA-B200

• JESD-609 Code:

  e1

• Length:

  14.5 mm

• Memory Density:

  4294967296 bit

• Memory IC Type:

  LPDDR4 DRAM

• Memory Width:

  32

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  200

• Number of Words:

  134217728 words

• Number of Words Code:

  128000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128MX32

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  WFBGA

• Package Equivalence Code:

  BGA200,12X22,32/25

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY VERY THIN PROFILE, FINE PITCH

• Refresh Cycles:

  8192

• Seated Height-Max:

  0.8 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  16,32

• Standby Current-Max:

  0.006 A

• Supply Current-Max:

  0.3 mA

• Supply Voltage-Max (Vsup):

  1.17 V

• Supply Voltage-Min (Vsup):

  1.06 V

• Supply Voltage-Nom (Vsup):

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  10 mm