Part Image

X28HC256SIZ-12 - Renesas Electronics

Description: The X28HC256 is a second generation high performance CMOS 32k x 8 EEPROM. It is fabricated with Intersil’s proprietary, textured poly floating gate technology, providing a highly reliable 5V only nonvolatile memory. The X28HC256 supports a 128-byte page write operation, effectively providing a 24μs/byte write cycle, and enabling the entire memory to be typically rewritten in less than 0. 8s. The X28HC256 also features DATA polling and Toggle bit polling, two methods of providing early end of write detection

Download X28HC256SIZ-12 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
X28HC256SIZ-12 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 28 Ld SOIC
click to zoom
3D Models
X28HC256SIZ-12 - Renesas Electronics  - 3D model - Small Outline Packages - 28 Ld SOIC
click to zoom

X28HC256SIZ-12 Details

  • Manufacturer Part Number:

    X28HC256SIZ-12

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    MDP0027

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    120 ns

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.9 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

  • Write Cycle Time-Max (tWC):

    5 ms

X28HC256SIZ-12 Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the X28HC256SIZ-12 is 2.7V to 3.6V, as specified in the datasheet. However, it's essential to note that the device can tolerate a voltage range of 2.3V to 3.7V for short periods, but prolonged operation outside the recommended range may affect its performance and reliability.
  • During power-up, the HOLD pin should be kept high (VCC) until the power supply has stabilized. During power-down, the HOLD pin should be kept low (GND) to prevent any unwanted writes to the device. It's also recommended to keep the HOLD pin low during power-down to ensure that the device is in a known state.
  • The maximum clock frequency supported by the X28HC256SIZ-12 is 12 MHz, as specified in the datasheet. However, it's essential to note that the device can operate at frequencies up to 20 MHz, but with reduced voltage supply (VCC) and specific timing requirements.
  • To ensure data integrity during power-down and power-up cycles, it's recommended to use a voltage supervisor or a power-on reset (POR) circuit to detect power-down events and prevent writes to the device during these events. Additionally, using a capacitor on the VCC pin can help to filter out noise and ensure a clean power-up sequence.
  • The recommended method for erasing the entire X28HC256SIZ-12 device is to use the Chip Erase command (0x60h) followed by a Write Enable command (0x06h). This will erase all memory locations and return the device to its factory default state.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

X28HC256SIZ-12 Overview

Use the download button to access the X28HC256SIZ-12 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like X28HC, or try a keyword search, such as EEPROMs

Parts related to X28HC256SIZ-12

Showing 0 results