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XA7S100-1FGGA484Q - AMD

Description: FPGA - Field Programmable Gate Array

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PCB Footprints
XA7S100-1FGGA484Q - AMD PCB footprint - BGA - BGA - FGGA484 (Spartan-7 FPGAs) Wire-Bond Fine-Pitch BGA (1.0 mm Pitch)_1
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3D Models
XA7S100-1FGGA484Q - AMD  - 3D model - BGA - FGGA484 (Spartan-7 FPGAs) Wire-Bond Fine-Pitch BGA (1.0 mm Pitch)_1
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XA7S100-1FGGA484Q Details

  • Manufacturer Part Number:

    XA7S100-1FGGA484Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    9.4

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    8000

  • Number of Inputs:

    338

  • Number of Logic Cells:

    102400

  • Number of Outputs:

    338

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

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XA7S100-1FGGA484Q Overview

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