XC2C256-7CP132I - AMD

XC2C256-7CP132I Details

• Manufacturer Part Number:

  XC2C256-7CP132I

• Part Life Cycle Code:

  Obsolete

• Package Description:

  8 X 8 MM, 0.50 MM PITCH, CSP-132

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.55

• Manufacturer:

  AMD

• YTEOL:

  0

• Additional Feature:

  REAL DIGITAL DESIGN TECHNOLOGY

• Architecture:

  PLA-TYPE

• Clock Frequency-Max:

  108 MHz

• In-System Programmable:

  YES

• JESD-30 Code:

  S-PBGA-B132

• JESD-609 Code:

  e0

• JTAG BST:

  YES

• Length:

  8 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  106

• Number of Inputs:

  106

• Number of Macro Cells:

  256

• Number of Outputs:

  106

• Number of Terminals:

  132

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  0 DEDICATED INPUTS, 106 I/O

• Output Function:

  MACROCELL

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA132,14X14,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  240

• Programmable Logic Type:

  FLASH PLD

• Propagation Delay:

  7.5 ns

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max:

  1.9 V

• Supply Voltage-Min:

  1.7 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  8 mm