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XC2C32A-6CPG56C - AMD

Description: CPLD - Complex Programmable Logic Devices XC2C32A-6CPG56C

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PCB Footprints
XC2C32A-6CPG56C - AMD PCB footprint - BGA - BGA - CPG56
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XC2C32A-6CPG56C - AMD  - 3D model - BGA - CPG56
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XC2C32A-6CPG56C Details

  • Manufacturer Part Number:

    XC2C32A-6CPG56C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    6 X 6 MM, 0.50 MM PITCH, LEAD FREE, CSP-56

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    REAL DIGITAL DESIGN TECHNOLOGY

  • Clock Frequency-Max:

    300 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B56

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    33

  • Number of Macro Cells:

    32

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Organization:

    33 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA56,10X10,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    6 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.35 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

XC2C32A-6CPG56C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC2C32A-6CPG56C is 160 MHz, but it depends on the specific application and design implementation.
  • To implement a CDC, use the Xilinx-provided IP cores, such as the Clock Domain Crossing (CDC) IP, or use asynchronous FIFOs and synchronization circuits to ensure data integrity across clock domains.
  • The power consumption of the XC2C32A-6CPG56C depends on the specific design, operating frequency, and voltage. However, the typical power consumption is around 0.5W to 1.5W. Use the Xilinx Power Estimator (XPE) tool to get a more accurate estimate.
  • Yes, the XC2C32A-6CPG56C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its radiation-hardened design and compliance with various industry standards.
  • Use the Xilinx ISE Design Suite or Vivado Design Suite to configure the XC2C32A-6CPG56C. These tools provide a comprehensive development environment for designing, implementing, and verifying your application.

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XC2C32A-6CPG56C Overview

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