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XC3S100E-4VQG100I - AMD

Description: FPGA - Field Programmable Gate Array XC3S100E-4VQG100I

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XC3S100E-4VQG100I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQG100
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XC3S100E-4VQG100I - AMD  - 3D model - Quad Flat Packages - VQG100
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XC3S100E-4VQG100I Details

  • Manufacturer Part Number:

    XC3S100E-4VQG100I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    572 MHz

  • Combinatorial Delay of a CLB-Max:

    0.76 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    240

  • Number of Equivalent Gates:

    100000

  • Number of Inputs:

    66

  • Number of Logic Cells:

    2160

  • Number of Outputs:

    59

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    240 CLBS, 100000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC3S100E-4VQG100I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S100E-4VQG100I is -40°C to 100°C (industrial grade).
  • You can implement CDC using synchronizers, FIFOs, or other specialized IP cores. Xilinx provides guidelines and tools to help with CDC implementation.
  • The power consumption of XC3S100E-4VQG100I depends on the specific design and usage. However, the typical static power consumption is around 0.5W, and the dynamic power consumption can range from 1W to 5W depending on the clock frequency and activity.
  • Yes, XC3S100E-4VQG100I is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its industrial-grade temperature range and robust design.
  • You can configure the FPGA using Xilinx's Vivado Design Suite or ISE Design Suite, which provide tools for design entry, synthesis, implementation, and bitstream generation.

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XC3S100E-4VQG100I Overview

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Part Image XC3S100E-4VQG100IS1 AMD Xilinx

Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PQFP100

Part Image XC3S100E-4VQ100C AMD Xilinx

Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PQFP100

Part Image XC3S100E-4VQ100IS1 AMD Xilinx

Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PQFP100

Part Image XC3S100E-4VQG100I AMD Xilinx

Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PQFP100

Part Image XC3S100E-4VQ100CS1 AMD Xilinx

Field Programmable Gate Array, 240 CLBs, 100000 Gates, 572MHz, 2160-Cell, CMOS, PQFP100

For a full list of alternate parts for XC3S100E-4VQG100I, check out Findchips.com