XC3S200-4TQG144I - AMD

XC3S200-4TQG144I Details

• Manufacturer Part Number:

  XC3S200-4TQG144I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  22 X 22 MM, LEAD FREE, TQFP-144

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  111 Weeks

• Manufacturer:

  AMD

• YTEOL:

  0

• Clock Frequency-Max:

  630 MHz

• Combinatorial Delay of a CLB-Max:

  0.61 ns

• JESD-30 Code:

  S-PQFP-G144

• JESD-609 Code:

  e3

• Length:

  20 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  480

• Number of Equivalent Gates:

  200000

• Number of Inputs:

  97

• Number of Logic Cells:

  4320

• Number of Outputs:

  97

• Number of Terminals:

  144

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  480 CLBS, 200000 GATES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFQFP

• Package Equivalence Code:

  QFP144,.87SQ,20

• Package Shape:

  SQUARE

• Package Style:

  FLATPACK, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS, 90 nm

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  20 mm