XC3S200AN-4FTG256C - AMD

XC3S200AN-4FTG256C Details

• Manufacturer Part Number:

  XC3S200AN-4FTG256C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  FTBGA-256

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  111 Weeks

• Manufacturer:

  AMD

• YTEOL:

  0

• Clock Frequency-Max:

  667 MHz

• Combinatorial Delay of a CLB-Max:

  0.71 ns

• JESD-30 Code:

  S-PBGA-B256

• JESD-609 Code:

  e1

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of CLBs:

  448

• Number of Equivalent Gates:

  200000

• Number of Inputs:

  195

• Number of Logic Cells:

  4032

• Number of Outputs:

  160

• Number of Terminals:

  256

• Operating Temperature-Max:

  85 °C

• Organization:

  448 CLBS, 200000 GATES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.55 mm

• Supply Voltage-Max:

  1.26 V

• Supply Voltage-Min:

  1.14 V

• Supply Voltage-Nom:

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS, 90 nm

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  17 mm