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XC3S250E-4VQG100C - AMD

Description: FPGA - Field Programmable Gate Array XC3S250E-4VQG100C

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XC3S250E-4VQG100C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQG100
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XC3S250E-4VQG100C - AMD  - 3D model - Quad Flat Packages - VQG100
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XC3S250E-4VQG100C Details

  • Manufacturer Part Number:

    XC3S250E-4VQG100C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    572 MHz

  • Combinatorial Delay of a CLB-Max:

    0.76 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    612

  • Number of Equivalent Gates:

    250000

  • Number of Inputs:

    66

  • Number of Logic Cells:

    5508

  • Number of Outputs:

    59

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    612 CLBS, 250000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC3S250E-4VQG100C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S250E-4VQG100C is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a CDC in XC3S250E-4VQG100C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum current draw for XC3S250E-4VQG100C is approximately 1.5A for the core voltage (VCCINT) and 0.5A for the I/O voltage (VCCO).
  • To optimize power consumption, use the Xilinx Power Analyzer tool, reduce clock frequencies, use low-power modes, and optimize the design for low power consumption.
  • The maximum frequency for the clock input of XC3S250E-4VQG100C is 350 MHz.

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XC3S250E-4VQG100C Overview

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Part Image XC3S250E-4VQG100C AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100

Part Image XC3S250E-4VQ100IS1 AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100

Part Image XC3S250E-4VQG100CS1 AMD Xilinx

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100

Part Image XC3S250E-4VQG100IS1 AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100

Part Image XC3S250E-4VQ100C AMD

Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PQFP100

For a full list of alternate parts for XC3S250E-4VQG100C, check out Findchips.com