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XC3S400A-5FTG256C - AMD

Description: FPGA - Field Programmable Gate Array XC3S400A-5FTG256C CONNECTING EBOM TO MARKETING PART

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XC3S400A-5FTG256C - AMD PCB footprint - BGA - BGA - FT256/FTG256
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XC3S400A-5FTG256C - AMD  - 3D model - BGA - FT256/FTG256
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XC3S400A-5FTG256C Details

  • Manufacturer Part Number:

    XC3S400A-5FTG256C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FTBGA-256

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    770 MHz

  • Combinatorial Delay of a CLB-Max:

    0.62 ns

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    896

  • Number of Equivalent Gates:

    400000

  • Number of Inputs:

    195

  • Number of Logic Cells:

    8064

  • Number of Outputs:

    160

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    896 CLBS, 400000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC3S400A-5FTG256C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC3S400A-5FTG256C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • Use the Xilinx Clocking Wizard tool to generate a clocking scheme that meets your design requirements. Ensure that you follow the recommended clocking architecture and use the dedicated clock resources (e.g., DCM, PLL) to minimize clock skew and jitter.
  • Use the Xilinx Power Estimator tool to analyze your design's power consumption. Optimize your design by reducing clock frequencies, using low-power modes, and implementing power-gating techniques. Additionally, consider using the FPGA's built-in power management features, such as the Power Management Controller (PMC).
  • Use a reliable configuration mechanism, such as the Xilinx Platform Flash (XF) or a non-volatile memory (NVM) device. Ensure that your configuration data is correctly formatted and that you follow the recommended configuration sequence. Additionally, implement a robust boot-up sequence that includes error detection and correction mechanisms.
  • The XC3S400A-5FTG256C has limited I/O resources, with 256 user I/Os. Be mindful of the I/O utilization and plan your design accordingly. Consider using I/O multiplexing, serialization, or deserialization to optimize I/O usage.

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XC3S400A-5FTG256C Overview

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