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XC4VFX12-10SFG363C - AMD

Description: FPGA - Field Programmable Gate Array XC4VFX12-10SFG363C - Pb-free

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XC4VFX12-10SFG363C - AMD PCB footprint - BGA - BGA - SFG363
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XC4VFX12-10SFG363C - AMD  - 3D model - BGA - SFG363
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XC4VFX12-10SFG363C Details

  • Manufacturer Part Number:

    XC4VFX12-10SFG363C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, FBGA-363

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    5.4

  • Clock Frequency-Max:

    1028 MHz

  • Combinatorial Delay of a CLB-Max:

    0.2 ns

  • JESD-30 Code:

    S-PBGA-B363

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    1368

  • Number of Inputs:

    240

  • Number of Logic Cells:

    12312

  • Number of Outputs:

    240

  • Number of Terminals:

    363

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1368 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA363,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

XC4VFX12-10SFG363C Frequently Asked Questions (FAQs)

  • The XC4VFX12-10SFG363C has an operating temperature range of -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808. The datasheet provides guidelines for implementing a POR circuit.
  • Xilinx provides detailed PCB layout and routing guidelines in the 'Virtex-4 FPGA PCB Design and Pin Planning Guide' (UG068). It covers topics like signal integrity, power distribution, and thermal management.
  • Follow Xilinx's signal integrity guidelines, use differential signaling, and implement proper termination and shielding techniques. Additionally, use EMI-reducing techniques like spread spectrum clocking and minimize signal transitions.
  • Xilinx provides the Vivado Design Suite, which includes tools for design entry, synthesis, implementation, and verification. Additionally, there are third-party tools and IP cores available for specific applications.

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XC4VFX12-10SFG363C Overview

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Part Image XC4VFX12-10SFG363I AMD

Field Programmable Gate Array, 1368 CLBs, 1028MHz, 12312-Cell, CMOS, PBGA363

Part Image XC4VFX12-10SFG363I AMD Xilinx

Field Programmable Gate Array, 1368 CLBs, 1028MHz, 12312-Cell, CMOS, PBGA363

Part Image XC4VFX12-10SFG363C AMD Xilinx

Field Programmable Gate Array, 1368 CLBs, 1028MHz, 12312-Cell, CMOS, PBGA363