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XC4VFX60-10FFG1152C - AMD

Description: XC4VFX60-10FFG1152C, FPGA Virtex-4 56880 Cells, 404480bit, 56880 Blocks, 1.14 → 1.26 V 1152-Pin FCBGA

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XC4VFX60-10FFG1152C - AMD PCB footprint - BGA - BGA - FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VFX60-10FFG1152C - AMD  - 3D model - BGA - FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VFX60-10FFG1152C Details

  • Manufacturer Part Number:

    XC4VFX60-10FFG1152C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, FBGA-1152

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    5

  • Clock Frequency-Max:

    1028 MHz

  • Combinatorial Delay of a CLB-Max:

    0.2 ns

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    6320

  • Number of Inputs:

    576

  • Number of Logic Cells:

    56880

  • Number of Outputs:

    576

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    85 °C

  • Organization:

    6320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC4VFX60-10FFG1152C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC4VFX60-10FFG1152C is 550 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption.
  • The XC4VFX60-10FFG1152C has a total of 11,088 Kbits of block RAM, 216 Kbits of distributed RAM, and 128 bits of FIFO RAM.
  • Yes, the XC4VFX60-10FFG1152C is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications.
  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to analyze and optimize your design, and follow best practices for PCB design, such as using differential signaling and shielding.

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XC4VFX60-10FFG1152C Overview

Use the download button to access the XC4VFX60-10FFG1152C schematic symbol, PCB footprint, and 3D model.
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Image Part Number Model
Part Image XC4VFX60-10FFG1152I AMD

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FF1152C AMD

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FFG1152C AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FF1152I AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FFG1152I AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

For a full list of alternate parts for XC4VFX60-10FFG1152C, check out Findchips.com