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XC5VFX100T-1FF1136I - AMD

Description: FPGA - Field Programmable Gate Array XC5VFX100T-1FF1136I

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XC5VFX100T-1FF1136I - AMD PCB footprint - BGA - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package
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XC5VFX100T-1FF1136I - AMD  - 3D model - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package
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XC5VFX100T-1FF1136I Details

  • Manufacturer Part Number:

    XC5VFX100T-1FF1136I

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1136

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6

  • Combinatorial Delay of a CLB-Max:

    0.9 ns

  • JESD-30 Code:

    S-PBGA-B1136

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    8000

  • Number of Inputs:

    640

  • Number of Logic Cells:

    102400

  • Number of Outputs:

    640

  • Number of Terminals:

    1136

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1136,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC5VFX100T-1FF1136I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC5VFX100T-1FF1136I is 550 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage frequency scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
  • The XC5VFX100T-1FF1136I has a total of 11,440 Kbits of block RAM, 64 Kbits of distributed RAM, and 2,400 Kbits of ROM.
  • Yes, the XC5VFX100T-1FF1136I is suitable for high-reliability applications due to its immunity to single-event upsets (SEUs) and its ability to detect and correct errors using built-in error correction mechanisms.
  • To ensure signal integrity and reduce noise, use the Xilinx ISE Design Suite to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential signaling, shielding, and decoupling capacitors.

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XC5VFX100T-1FF1136I Overview

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Field Programmable Gate Array, 8000 CLBS, 102400-Cell, CMOS, PBGA1136

Part Image XC5VFX100T-1FFG1136I AMD Xilinx

Field Programmable Gate Array, 8000 CLBS, 102400-Cell, CMOS, PBGA1136