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XC5VFX70T-2FF1136I - AMD

Description: FPGA - Field Programmable Gate Array XC5VFX70T-2FF1136I

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XC5VFX70T-2FF1136I - AMD PCB footprint - BGA - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package
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XC5VFX70T-2FF1136I Details

  • Manufacturer Part Number:

    XC5VFX70T-2FF1136I

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1136

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6

  • Combinatorial Delay of a CLB-Max:

    0.77 ns

  • JESD-30 Code:

    S-PBGA-B1136

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5600

  • Number of Inputs:

    640

  • Number of Logic Cells:

    71680

  • Number of Outputs:

    640

  • Number of Terminals:

    1136

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5600 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1136,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC5VFX70T-2FF1136I Frequently Asked Questions (FAQs)

  • The XC5VFX70T-2FF1136I has an industrial temperature range of -40°C to 100°C.
  • Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808.
  • Xilinx provides guidelines for PCB layout and routing in the 'Virtex-5 FPGA PCB Design and Pin Planning Guide' (UG440). Key considerations include signal integrity, power distribution, and thermal management.
  • Use Xilinx's Power Estimator (XPE) tool to estimate power consumption, and implement power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The recommended settings depend on the specific application and design requirements. Consult the 'Virtex-5 FPGA Configuration User Guide' (UG191) and the 'Virtex-5 FPGA Data Sheet' (DS202) for guidance.

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XC5VFX70T-2FF1136I Overview

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Part Image XC5VFX70T-2FFG1136C AMD

Field Programmable Gate Array, 5600 CLBS, 71680-Cell, CMOS, PBGA1136

Part Image XC5VFX70T-2FFG1136I AMD

Field Programmable Gate Array, 5600 CLBS, 71680-Cell, CMOS, PBGA1136

Part Image XC5VFX70T-2FF1136I AMD Xilinx

Field Programmable Gate Array, 5600 CLBS, 71680-Cell, CMOS, PBGA1136

Part Image XC5VFX70T-2FFG1136C AMD Xilinx

Field Programmable Gate Array, 5600 CLBS, 71680-Cell, CMOS, PBGA1136

Part Image XC5VFX70T-2FFV1136C AMD Xilinx

Field Programmable Gate Array, 5600 CLBS, 71680-Cell, CMOS, PBGA1136

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