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XC6SLX100-3FGG676C - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX100-3FGG676C

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XC6SLX100-3FGG676C Details

  • Manufacturer Part Number:

    XC6SLX100-3FGG676C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    862 MHz

  • Combinatorial Delay of a CLB-Max:

    0.21 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7911

  • Number of Inputs:

    480

  • Number of Logic Cells:

    101261

  • Number of Outputs:

    480

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7911 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC6SLX100-3FGG676C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX100-3FGG676C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption using techniques like pipelining and parallel processing.
  • The XC6SLX100-3FGG676C has a total of 37,440 Kbits of block RAM, 4,320 Kbits of distributed RAM, and 64 Kbits of ROM.
  • Yes, the XC6SLX100-3FGG676C has built-in support for high-speed serial interfaces like PCIe Gen1 and SATA II, with dedicated transceivers and PHYs.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, which can be integrated into your design. The XC6SLX100-3FGG676C has dedicated DDR3 memory interface pins and supports speeds up to 1066 Mbps.

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XC6SLX100-3FGG676C Overview

Use the download button to access the XC6SLX100-3FGG676C 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC6SL, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XC6SLX100-3FGG676C AMD Xilinx

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676C AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676I AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, CMOS, PBGA676

Part Image XC6SLX100-3FG676Q AMD Xilinx

Field Programmable Gate Array

Part Image XC6SLX100-3FG676Q AMD

Field Programmable Gate Array, 7911 CLBs, 862MHz, 101261-Cell, PBGA676

For a full list of alternate parts for XC6SLX100-3FGG676C, check out Findchips.com