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XC7A12T-L1CPG238I - AMD

Description: XC7A12T-L1CPG238I

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PCB Footprints
XC7A12T-L1CPG238I - AMD PCB footprint - BGA - BGA - CP236 and CPG236 (Artix-7 FPGAs) Wire-Bond Chip-Scale BGA (0.5 mm Pitch)
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3D Models
XC7A12T-L1CPG238I - AMD  - 3D model - BGA - CP236 and CPG236 (Artix-7 FPGAs) Wire-Bond Chip-Scale BGA (0.5 mm Pitch)
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XC7A12T-L1CPG238I Details

  • Manufacturer Part Number:

    XC7A12T-L1CPG238I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-238

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B238

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Number of CLBs:

    1000

  • Number of Inputs:

    112

  • Number of Logic Cells:

    12800

  • Number of Outputs:

    112

  • Number of Terminals:

    238

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA238,19X19,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    HKMG, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    10 mm

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XC7A12T-L1CPG238I Overview

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Part Image XC7A12T-1CPG238C AMD Xilinx

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