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XC7A200T-2FFG1156I - AMD

Description: FPGA - Field Programmable Gate Array XC7A200T-2FFG1156I

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XC7A200T-2FFG1156I - AMD PCB footprint - BGA - BGA - FFG1156
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XC7A200T-2FFG1156I - AMD  - 3D model - BGA - FFG1156
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XC7A200T-2FFG1156I Details

  • Manufacturer Part Number:

    XC7A200T-2FFG1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    16825

  • Number of Inputs:

    500

  • Number of Logic Cells:

    215360

  • Number of Outputs:

    500

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.1 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC7A200T-2FFG1156I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A200T-2FFG1156I is 500 MHz.
  • You can implement a DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • The power consumption of the XC7A200T-2FFG1156I depends on the operating frequency, voltage, and design complexity. However, the typical power consumption is around 10-15W.
  • Yes, the XC7A200T-2FFG1156I is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault-tolerant features.
  • To optimize the design for area and speed, use the Vivado Design Suite's optimization tools, such as the 'Optimize for Area' and 'Optimize for Speed' options. Additionally, consider using pipelining, parallel processing, and resource sharing to improve performance.

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XC7A200T-2FFG1156I Overview

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Part Image XC7A200T-2FFG1156C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, PBGA1156

Part Image XC7A200T-2FFG1156C AMD

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, PBGA1156

Part Image XC7A200T-2FFV1156C AMD

Field Programmable Gate Array, 16825 CLBs, PBGA1156

Part Image XC7A200T-2FFG1156I AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, 1286MHz, 215360-Cell, PBGA1156

Part Image XC7A200T-2FFV1156C AMD Xilinx

Field Programmable Gate Array, 16825 CLBs, PBGA1156

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