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XC7A50T-2CPG236I - AMD

Description: Artix-7 Field Programmable Gate Array (FPGA) IC 106 2764800 52160 238-LFBGA, CSPBGA

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XC7A50T-2CPG236I - AMD PCB footprint - BGA - BGA - CPG236
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XC7A50T-2CPG236I - AMD  - 3D model - BGA - CPG236
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XC7A50T-2CPG236I Details

  • Manufacturer Part Number:

    XC7A50T-2CPG236I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-236

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B236

  • JESD-609 Code:

    e8

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4075

  • Number of Inputs:

    106

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    106

  • Number of Terminals:

    236

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA236,19X19,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.38 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

XC7A50T-2CPG236I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A50T-2CPG236I is 500 MHz, but it depends on the specific application and design implementation.
  • You can use the MIG (Memory Interface Generator) tool provided by Xilinx to generate a DDR3 memory interface IP core for the XC7A50T-2CPG236I. The tool helps you configure and implement the interface according to your specific requirements.
  • The power consumption of the XC7A50T-2CPG236I depends on various factors such as the operating frequency, voltage, and design implementation. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 2.5W to 10W depending on the usage.
  • Yes, the XC7A50T-2CPG236I is suitable for high-speed data acquisition applications due to its high-speed transceivers, low latency, and high-bandwidth memory interfaces. However, the specific implementation and design requirements will depend on the application's needs.
  • Xilinx provides various tools and methodologies for debugging and testing the XC7A50T-2CPG236I, including ChipScope, ILA (Integrated Logic Analyzer), and VIO (Virtual Input/Output). These tools help you monitor and analyze the device's behavior, identify issues, and optimize performance.

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XC7A50T-2CPG236I Overview

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Part Image XC7A50T-2CPG236C AMD

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA236

Part Image XC7A50T-2CPG236I AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA236