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XC7A75T-1CSG324C - AMD

Description: XILINX - XC7A75T-1CSG324C - FPGA, ARTIX-7, 210 I/O, CSBGA-324

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XC7A75T-1CSG324C - AMD PCB footprint - BGA - BGA - (Artix-7 FPGAs) Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC7A75T-1CSG324C - AMD  - 3D model - BGA - (Artix-7 FPGAs) Wire-Bond Chip-Scale BGA (0.8 mm Pitch)
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XC7A75T-1CSG324C Details

  • Manufacturer Part Number:

    XC7A75T-1CSG324C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    5900

  • Number of Inputs:

    210

  • Number of Logic Cells:

    75520

  • Number of Outputs:

    210

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    5900 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

XC7A75T-1CSG324C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7A75T-1CSG324C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for low power consumption.
  • The -1 speed grade has a higher maximum clock frequency (350 MHz) compared to the -2 speed grade (250 MHz), but the -2 speed grade has lower power consumption.
  • Yes, the XC7A75T-1CSG324C is suitable for high-reliability applications, as it is designed for industrial and automotive markets, and meets various industry standards for reliability and quality.
  • Implement secure boot by using the Xilinx Secure Boot mechanism, which involves encrypting the bitstream, using a secure key, and configuring the FPGA to boot securely.

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XC7A75T-1CSG324C Overview

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Part Image XC7A75T-1CSG324C AMD Xilinx

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Part Image XC7A75T-1CS324I AMD Xilinx

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