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XC7K160T-2FF676I - AMD

Description: XILINX - XC7K160T-2FF676I - FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 162240 Cells, 970 mV to 1.03 V, FCBGA-676

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PCB Footprints
XC7K160T-2FF676I - AMD PCB footprint - BGA - BGA - 676-FCBGA (27x27)_2023
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3D Models
XC7K160T-2FF676I - AMD  - 3D model - BGA - 676-FCBGA (27x27)_2023
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XC7K160T-2FF676I Details

  • Manufacturer Part Number:

    XC7K160T-2FF676I

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    12675

  • Number of Inputs:

    400

  • Number of Logic Cells:

    162240

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    12675 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.37 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

XC7K160T-2FF676I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the XC7K160T-2FF676I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Use the Xilinx Clocking Wizard tool to generate a clocking scheme that meets your design requirements. This tool helps you create a clocking architecture that ensures reliable clock distribution and minimizes skew and jitter.
  • The recommended power supply voltage for the XC7K160T-2FF676I is 1.0V ± 10% for the core voltage (VCCINT) and 1.8V ± 10% for the I/O voltage (VCCO).
  • Use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption.
  • The maximum bandwidth of the XC7K160T-2FF676I's high-speed transceivers is 12.5 Gbps.

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XC7K160T-2FF676I Overview

Use the download button to access the XC7K160T-2FF676I schematic symbol, PCB footprint, and 3D model.
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Image Part Number Model
Part Image XC7K160T-2FFG676I AMD Xilinx

Field Programmable Gate Array, 12675 CLBs, 1286MHz, 162240-Cell, CMOS, PBGA676

Part Image XC7K160T-2FF676C AMD

Field Programmable Gate Array, 12675 CLBs, 1818MHz, 162240-Cell, CMOS, PBGA676

Part Image XC7K160T-2FF676I AMD Xilinx

Field Programmable Gate Array, 12675 CLBs, 1818MHz, 162240-Cell, CMOS, PBGA676

Part Image XC7K160T-2FF676C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 162240-Cell, CMOS, PBGA676

Part Image XC7K160T-2FFG676E AMD Xilinx

Field Programmable Gate Array, PBGA676

For a full list of alternate parts for XC7K160T-2FF676I, check out Findchips.com