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XC7K325T-2FBG676I - AMD

Description: FPGA - Field Programmable Gate Array XC7K325T-2FBG676I

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XC7K325T-2FBG676I Details

  • Manufacturer Part Number:

    XC7K325T-2FBG676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    25475

  • Number of Inputs:

    400

  • Number of Logic Cells:

    326080

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    25475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7K325T-2FBG676I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K325T-2FBG676I is 500 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequency, use low-power modes, and optimize the design for low power consumption.
  • The -2 speed grade has a maximum clock frequency of 500 MHz, while the -3 speed grade has a maximum clock frequency of 550 MHz. The -3 speed grade is faster but also consumes more power.
  • Yes, the XC7K325T-2FBG676I is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high-quality manufacturing process and robust design.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, and then integrate it into your design using the Vivado Design Suite.

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XC7K325T-2FBG676I Overview

Use the download button to access the XC7K325T-2FBG676I 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7K3, or try a keyword search, such as Field Programmable Gate Arrays

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XC7K325T-2FBG676I Alternates

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Image Part Number Model
Part Image XC7K325T-2FBG676E AMD

Field Programmable Gate Array, 25475 CLBs, 1818MHz, PBGA676

Part Image XC7K325T-2FB676C AMD

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA676

Part Image XC7K325T-2FBG676I AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA676

Part Image XC7K325T-2FB676I AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA676

Part Image XC7K325T-2FBV676I AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, PBGA676

For a full list of alternate parts for XC7K325T-2FBG676I, check out Findchips.com