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XC7K325T-2FF900I - AMD

Description: FPGA - Field Programmable Gate Array XC7K325T-2FF900I

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XC7K325T-2FF900I - AMD PCB footprint - BGA - BGA - FF900
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XC7K325T-2FF900I Details

  • Manufacturer Part Number:

    XC7K325T-2FF900I

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-900

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e0

  • Length:

    31 mm

  • Number of CLBs:

    25475

  • Number of Inputs:

    500

  • Number of Logic Cells:

    326080

  • Number of Outputs:

    500

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    25475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.35 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

XC7K325T-2FF900I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K325T-2FF900I is 500 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates IP cores and example designs for DDR3 interfaces.
  • The power consumption of the XC7K325T-2FF900I depends on the specific application, clock frequency, and design implementation. However, the typical power consumption is around 10-15W. You can use Xilinx's Power Estimator tool to get a more accurate estimate.
  • Yes, the XC7K325T-2FF900I is capable of supporting high-speed serial interfaces like PCIe and SATA. It has built-in transceivers that support speeds up to 12.5 Gbps.
  • Xilinx provides various security features, such as bitstream encryption, secure boot, and anti-tamper features, to secure your design on the XC7K325T-2FF900I. You can also use third-party IP cores and tools to enhance security.

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XC7K325T-2FF900I Overview

Use the download button to access the XC7K325T-2FF900I schematic symbol, PCB footprint, and 3D model.
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XC7K325T-2FF900I Alternates

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Part Image XC7K325T-2FFG900C AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900
Part Image XC7K325T-2FFG900I AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900
Part Image XC7K325T-2FF900C AMD

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900
Part Image XC7K325T-2FF900I AMD Xilinx

Field Programmable Gate Array, 25475 CLBs, 1818MHz, 326080-Cell, CMOS, PBGA900
Part Image XC7K325T-2FFV900I AMD Xilinx

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For a full list of alternate parts for XC7K325T-2FF900I, check out Findchips.com