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XC7K410T-1FBG900I - AMD

Description: FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 900-Pin Lidless FC-BGA - Trays

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PCB Footprints
XC7K410T-1FBG900I - AMD PCB footprint - BGA - BGA - FB900, FBG900, and FBV900 (Kintex-7 FPGAs) Flip-Chip Lidless BGA (1.0 mm Pitch)
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3D Models
XC7K410T-1FBG900I - AMD  - 3D model - BGA - FB900, FBG900, and FBV900 (Kintex-7 FPGAs) Flip-Chip Lidless BGA (1.0 mm Pitch)
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XC7K410T-1FBG900I Details

  • Manufacturer Part Number:

    XC7K410T-1FBG900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    0.3 ns

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    31775

  • Number of Inputs:

    500

  • Number of Logic Cells:

    406720

  • Number of Outputs:

    500

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    31775 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XC7K410T-1FBG900I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K410T-1FBG900I is 500 MHz, but it depends on the specific application and design implementation.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates IP cores and example designs for DDR3 interfaces.
  • The power consumption of the XC7K410T-1FBG900I depends on the specific design and usage. However, according to the datasheet, the typical static power consumption is around 2.5W, and the dynamic power consumption can range from 5W to 15W or more, depending on the clock frequency and activity.
  • Yes, the XC7K410T-1FBG900I is capable of supporting high-speed serial interfaces like PCIe and SATA, thanks to its high-speed transceivers and built-in PHYs. However, you may need to use additional IP cores or third-party solutions to implement the specific protocol logic.
  • You can use Xilinx's Vivado Design Suite, which provides a comprehensive development environment for designing, testing, and debugging FPGA designs. Additionally, you can use tools like ChipScope and ILA (Integrated Logic Analyzer) to debug and analyze your design.

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XC7K410T-1FBG900I Overview

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Image Part Number Model
Part Image XC7K410T-1FBG900C AMD

Field Programmable Gate Array, 31775 CLBs, 1098MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-1FBG900I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, 1098MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-1FBG900E AMD

Field Programmable Gate Array, PBGA900

Part Image XC7K410T-1FBV900I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, PBGA900

Part Image XC7K410T-1FBV900C AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, PBGA900

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