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XC7K410T-2FBG900I - AMD

Description: FPGA - Field Programmable Gate Array XC7K410T-2FBG900I

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XC7K410T-2FBG900I Details

  • Manufacturer Part Number:

    XC7K410T-2FBG900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-900

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B900

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    31775

  • Number of Inputs:

    500

  • Number of Logic Cells:

    406720

  • Number of Outputs:

    500

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    31775 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA900,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    31 mm

XC7K410T-2FBG900I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K410T-2FBG900I is 500 MHz, but it depends on the specific application and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies, voltage, and logic utilization. Additionally, consider using the low-power modes and implementing power-saving techniques in your design.
  • The -2 speed grade has a maximum clock frequency of 500 MHz, while the -3 speed grade has a maximum clock frequency of 450 MHz. The -3 speed grade is more power-efficient and suitable for applications that don't require the highest clock frequencies.
  • No, the XC7K410T-2FBG900I is not designed for high-reliability or radiation-hardened applications. For such applications, consider using Xilinx's QPro or Rad-Hard devices, which are specifically designed for these environments.
  • To ensure signal integrity and reduce noise, follow Xilinx's guidelines for PCB design, use proper termination and routing techniques, and implement noise reduction techniques such as shielding, filtering, and decoupling.

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XC7K410T-2FBG900I Overview

Use the download button to access the XC7K410T-2FBG900I 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7K4, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XC7K410T-2FBG900C AMD

Field Programmable Gate Array, 31775 CLBs, 1286MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-2FB900C AMD

Field Programmable Gate Array, 31775 CLBs, 1818MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-2FB900I AMD Xilinx

Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-2FBG900I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, 1286MHz, 406720-Cell, CMOS, PBGA900

Part Image XC7K410T-2FBG900E AMD Xilinx

Field Programmable Gate Array, PBGA900

For a full list of alternate parts for XC7K410T-2FBG900I, check out Findchips.com