- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for XC7S25-1CSGA225C
- Part Number XC7S25-1CSGA225C
- Manufacturer AMD
- Pin Count 225
- Part Category Integrated Circuit
- Package Category BGA
- Footprint Name BGA - CSGA225
- Released Date Jul 2, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
XC7S25-1CSGA225C Details
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Manufacturer Part Number:
XC7S25-1CSGA225C
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CSBGA-225
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Country Of Origin:
Taiwan
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HTS Code:
8542.31.00.60
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Factory Lead Time:
16 Weeks
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Manufacturer:
AMD
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YTEOL:
14
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Clock Frequency-Max:
1098 MHz
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Combinatorial Delay of a CLB-Max:
1.27 ns
XC7S25-1CSGA225C Frequently Asked Questions (FAQs)
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The maximum operating temperature range for XC7S25-1CSGA225C is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
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You can implement a reliable POR by using an external reset circuit or by using the internal POR circuitry. The internal POR circuitry is enabled by default and can be configured using the FPGA's configuration options.
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The recommended clocking scheme for XC7S25-1CSGA225C is to use a single clock domain for the entire design. However, if multiple clock domains are required, it's recommended to use clock domain crossing (CDC) techniques to ensure reliable data transfer between domains.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption and identify areas for optimization. Techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling can also be used to reduce power consumption.
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The maximum current draw for XC7S25-1CSGA225C is approximately 1.5A for the 1.0V core voltage and 0.5A for the 2.5V auxiliary voltage.
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XC7S25-1CSGA225C Overview
Use the download button to access the XC7S25-1CSGA225C schematic symbol, PCB footprint, and 3D model.
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