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XC7S25-1FTGB196I - AMD

Description: XC7S25-1FTGB196I

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XC7S25-1FTGB196I - AMD - PCB symbol
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PCB Footprints
XC7S25-1FTGB196I - AMD PCB footprint - BGA - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S25-1FTGB196I - AMD - 3D model - BGA - FTGB196 (Spartan-7 FPGAs) Wire-Bond Chip-Scale BGA (1.0 mm Pitch)
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XC7S25-1FTGB196I Details

  • Manufacturer Part Number:

    XC7S25-1FTGB196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e3

  • Length:

    15 mm

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S25-1FTGB196I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC7S25-1FTGB196I is 350 MHz.
  • You can implement DDR3 memory interface with XC7S25-1FTGB196I using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface.
  • Yes, XC7S25-1FTGB196I is suitable for high-reliability applications. It is fabricated using a 28nm process and has a high mean time between failures (MTBF). Additionally, Xilinx provides a range of tools and methodologies to ensure high reliability and fault tolerance.
  • You can optimize power consumption in XC7S25-1FTGB196I by using the Xilinx Power Estimator (XPE) tool, which provides an estimate of power consumption based on the design. You can also use power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, XC7S25-1FTGB196I is compatible with Linux. Xilinx provides a range of Linux-based development tools and operating systems, including PetaLinux, which is a Linux-based operating system for Zynq-7000 SoCs.

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XC7S25-1FTGB196I Overview

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XC7S25-1FTGB196I Alternates

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Part Image XC7S25-1FTGB196I AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1098MHz, 23360-Cell, PBGA196
Part Image XC7S25-1FTGB196Q AMD Xilinx

Field Programmable Gate Array, 1825 CLBS, 1098MHz, 23360-Cell, PBGA196