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XC7S25-L1FTGB196I - AMD

Description: XILINX - XC7S25-L1FTGB196I - FPGA, Spartan-7, 3650 Blocks, 23360 Macrocells, 1620Kbit RAM, 920mV to 980mV Core Supply, CSBGA-196

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PCB Footprints
XC7S25-L1FTGB196I - AMD PCB footprint - BGA - BGA - FTGB196
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XC7S25-L1FTGB196I - AMD  - 3D model - BGA - FTGB196
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XC7S25-L1FTGB196I Details

  • Manufacturer Part Number:

    XC7S25-L1FTGB196I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-196

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1098 MHz

  • Combinatorial Delay of a CLB-Max:

    1.27 ns

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e3

  • Length:

    15 mm

  • Number of CLBs:

    1825

  • Number of Inputs:

    150

  • Number of Logic Cells:

    23360

  • Number of Outputs:

    150

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1825 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    0.98 V

  • Supply Voltage-Min:

    0.92 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S25-L1FTGB196I Frequently Asked Questions (FAQs)

  • The XC7S25-L1FTGB196I has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • Xilinx provides a Clock Domain Crossing (CDC) guide that explains how to implement CDCs using the FPGA's built-in features, such as the Clock Wizard and the Synchronous FIFO. Additionally, Xilinx recommends using the Vivado Design Suite to implement CDCs.
  • The maximum power consumption of the XC7S25-L1FTGB196I depends on the specific configuration and usage. However, according to the datasheet, the typical static power consumption is around 1.2W, and the maximum dynamic power consumption is around 2.5W.
  • Yes, the XC7S25-L1FTGB196I has built-in support for high-speed serial interfaces like PCIe and SATA. It features high-speed transceivers that can operate at speeds up to 12.5 Gbps, making it suitable for high-speed applications.
  • Xilinx provides a range of security features, including bitstream encryption, secure boot, and anti-tamper features. Additionally, designers can use techniques like obfuscation, encryption, and secure key storage to protect their IP.

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XC7S25-L1FTGB196I Overview

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